Our QFN (Back Side Film) tape is a Highly Heat-Resistant Adhesive Tape adhered on the Leadframe at the back of a Semiconductor Package to prevent EMC molding leakage.
我们的 QFN (背后贴) 胶片是粘贴在半导体内的引线框架背面上，防止溢胶的高耐热粘接胶片。
| Use | Adhered on the back of a lead frame. Prevents mold leakage |
|---|---|
| Characteristic | Highly heat-resistant. Even after the tape is removed, no adhesive residue remains. No flash burr during EMC molding processing. Little warpage of lead frame even at high temperature. Excellent adhesive property with wires |
| 使用 | 附着于引线框架的背面 防止模具的溢胶。 |
|---|---|
| 特点 | 高耐热性 除掉胶带也不会残留粘合剂 在氧脂装饰线工程中没有毛刺 在高温中也减少引线框架的扭曲 与铁丝的附着力优异 |
For more details, email to Sales@Skymart-Group.com or Contact +65 9863 5593